Sizzix Die Brush & Foam Pad for Wafer-Thin Dies

Sizzix
£7.00
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Sizzix Die Brush & Foam Pad for Wafer-Thin Dies

When it comes to removing excess paper in all brands of wafer-thin, chemically-etched dies, the Sizzix Die Brush does it easily and ergonomically. With a sleek, ergonomic rubber-grip handle for non-slippage and easy manoeuvrability, the Die Brush easily rolls away excess paper to reveal the perfect cut!

The Die Brush includes a Foam Pad that acts as the perfect work surface for removing excess paper from the dies and even the cut-out.

This set contains 1 Die Brush ( 5 1/2" x 1 3/4" x 1/4") and 1 Foam Pad ( 4 1/2" x 7 1/4").

Creative Rox also has the Sizzix Die Pick for more paper removal options.

Sizzix Die Brush & Foam Pad for Wafer-Thin Dies: 660513

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